pennslammer36000| Glass substrates: Intel and Samsung plan to launch products equipped with glass substrates in 2026

Source Gangtise Investment Research

analysts saidpennslammer36000The advantages of glass substrates in chip packaging include low dielectric constant and loss factor, which help to improve the transmission integrity and speed of high-frequency signals; the main challenges faced by glass substrate packaging technology are punching and filling holes in glass, especially When the aperture is less than 30 microns, it is necessary to ensure no cracks and good bonding. Intel and Samsung plan to launch products equipped with glass substrates in 2026, and the industry as a whole is still in the mid-to-early stage.

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